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1. Compatible with 12inch and 8inch wafers; 2. Fully automatic operation, foupin-foupout; 3.dry in- dry out; 4.The program can select CU or plating Cu/Sn or plating Au and switch freely; 5. Scan code or RFID sensor automatic selection program, no operator selection; 6.. Stainless steel SUS316 frame, NPP coated, strong and corrosion resistant; 7. Industrial computer +PLC control, system stability; 8.Windows operating system, simple and convenient; 9. Support EAP function; 10. Compatible with semiconductor general SECS/GEM technical protocol; 11. With automatic add function.

Process Type: Au, Cu, Ni, Sn, Ag,Pd，Au/Sn alloy … Process Operation: Automatic Wafer types: Si, GaAs, GaN, InP,SiC, Ceramic, Glass...

RDL, Pillar, Bump, TSV, TGV